HAD8630P
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产品详情
1.采用国际领先的双邦四臂取固晶系统，具备搜寻系统，1个固晶平台 2.采用中空伺服马达搭配音圈电机驱动邦头旋转和上下 3.采用线性电机驱动搜寻晶片平台（X/Y），采用伺服和丝杆结构驱动送料平台（B/C），提高工作台定位时间 4.夹具平台底部采用吸真空方式，PCB在真空的作用下达到固晶平面高度一致，提高固晶速度及固晶质量 5.采用真空漏晶检测 6.采用左进右出流水线接驳台试自动上下料，方便机台连线 7.芯片平台增加自动换环功能，可以自动修正芯片角度 8.工控机控制设备运行，简化了自动化设备的操作 9.可移动修正的顶针结构，与双摆臂中心位时时吻合 10.芯片底部飞拍功能保证了固晶精度 HAD8630P model features: 1. Adopt the internationally leading dual-state four-arm chip taking system, with search system, 1 chip bonding platform 2. Use hollow servo motor with voice coil motor to drive the head to rotate and up and down 3. Use linear motor to drive the search wafer platform (X/Y), and use servo and screw structure to drive the feeding platform (B/C) to improve the positioning time of the workbench 4. The bottom of the fixture platform adopts the vacuum suction method, and the PCB achieves the same height of the bonding plane under the action of vacuum, which improves the bonding speed and quality of the bonding. 5. Using vacuum leakage detection 6. Use the left-in and right-out assembly line to connect to the platform to test automatic loading and unloading, which is convenient for machine connection 7. The chip platform adds automatic ring change function, which can automatically correct the chip angle 8. The industrial computer controls the operation of the equipment, which simplifies the operation of the automation equipment 9. Movable and revised thimble structure, consistent with the center position of the double swing arm from time to time 10. The flying shot function at the bottom of the chip ensures the precision of die bonding |
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