HAD816-B全自动高速固晶机

HAD816-B（全自动高速固晶机）

（周期： 120ms）

适合于矩阵式粘胶工艺的IC支架，如DFN/QFN系列、SOP系列

一、机型特性

1.点胶模组可扩展性适应客户支架；高达4组点胶针头，大大提高了点胶效率，每组点胶机构X/Y/Z向可调整方便调试维护；

2.采用线性电机驱动搜寻晶片平台（X/Y）与送料平台（B/C）；

3.wafer table自动校正芯片位置；

4.自主研发工控机控制系统，简单易操作&维护；

5.流量式芯片真空检测，稳定可靠；

6.自主研发视觉系统for pre-bond/pos-bond，稳定可靠；

7.材料/产品的全自动载入载出，高生产效率的保证；

8.固晶位置精准及优良的一致性，高品质产品的保证；

9.节拍：120毫秒/点，实际产出取决于芯片尺寸和支架上产品的密集度；

10.bondforce参数化调整，稳定可靠。

HAD816-B（Automatic High-speed Die Bonder）

（Cycle: 120ms）

It is compatible with IC leadframe of matrix viscose process, such as DFN/QFN series, SOP series.

Model Features

1. The dispensing module is expandable to adapt to customer support; up to 4 sets of dispensing needles, greatly improving the efficiency of dispensing. The Dispensing mechanism of each set can be adjusted in X/Y/Z direction for convenient debugging and maintenance.

2. Using linear motor to drive the search chip platform (X/Y) and the feeding platform (B/C);

3. Wafer table automatically corrects the position of the chip;

4. Independently developed industrial computer control system, easy to operate and maintain;

5. Flow type chip vacuum detection, stable and reliable;

6. Independently developed visual system for pre-bond/ pos-bond, stable and reliable;

7. Fully automatic loading and unloading of materials/products, ensuring high production efficiency;

8. Precise location of die bonding and excellent consistency, guarantee high quality products;

9. Beat: 120 ms/point, actual output depends on chip size and density of products on the bracket;

10. Bondforce parameterized adjustment, stable and reliable.