HAD812全自动半导体平面式高速固晶机

HAD812（全自动半导体平面式高速固晶机）

（周期： 250ms）

适用于IC类框架

一、机型特性

1.   直线电机驱动的双点胶系统；

2.   高精度直线驱动固晶绑头,音圈扭力环精确控制固晶压力；

3.   高精度搜寻芯片平台，伺服电机驱动芯片角度矫正系统，配备12寸晶圆自动扩膜系统；

4.   采用点胶独立控制系统，胶量控制更加精确；

5.   采用真空漏晶检测；

6.   工控机控制设备运行，简化了自动化设备的操作；

7.精准的自动化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；

HAD812

Automatic Plane-type Die Bonder

Cycle: 250ms

It is compatible with IC frame

1.        Linear motor is applied to drive double dispensing system.

2.        High precision linear motor drive die bonder, voice coil torsion loop controls die bond pressure accurately.

3.        High-precision die platform searching, servo motor driving die angle correction system, equipped with 12-inch wafer automatic film expansion system.

4.        A separate dispensing control system is adopted to make a precise control of dispensing amount.

5.        Vacuum die missing testing technology is adopted.

6.        IPC control the operation of equipment, simplifying the operation of automation equipment;

7.        Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.