HAD8630P

HAD8630P model features:

1. Adopt the internationally leading dual-state four-arm chip taking system, with search system, 1 chip bonding platform

2. Use hollow servo motor with voice coil motor to drive the head to rotate and up and down

3. Use linear motor to drive the search wafer platform (X/Y), and use servo and screw structure to drive the feeding platform (B/C) to improve the positioning time of the workbench

4. The bottom of the fixture platform adopts the vacuum suction method, and the PCB achieves the same height of the bonding plane under the action of vacuum, which improves the bonding speed and quality of the bonding.

5. Using vacuum leakage detection

6. Use the left-in and right-out assembly line to connect to the platform to test automatic loading and unloading, which is convenient for machine connection

7. The chip platform adds automatic ring change function, which can automatically correct the chip angle

8. The industrial computer controls the operation of the equipment, which simplifies the operation of the automation equipment

9. Movable and revised thimble structure, consistent with the center position of the double swing arm from time to time

10. The flying shot function at the bottom of the chip ensures the precision of die bonding