HAD8606-H

HAD8606-H
Details


HAD8606-H

Sextuple-head Plane-type High-speed Die Bonder

Single-head Cycle: 135ms

It is compatible with Mini LED PCB

Product Features

1.      International leading sextuple die bond, sextuple adhesive dispense and double die searching system; direct-wiring inside three die bond platforms, bonding three kinds of dies all at once on the substrate;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Vacuum picking method is adopted on the clamp base, uniformizing the bonding height of PCB to expedite the bonding and ensure the bonding quality simultaneously;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic loading and unloading system, two ways of loading(by magazine or conveyor ) and receiving by magazine or the conveyor which connected to another machine, improving the production efficiency largely;

7.      Adding automatic ring changing function on the die platform, correcting the die theta automatically;

8.      IPC will control the operation of equipment, simplifying the usage of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;


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