HAD816-A

HAD816-A（Automatic High-speed Die Bonder）

（Cycle: 120ms）

It is compatible with IC leadframe of matrix viscose process, such as DFN/QFN series, SOP series.

Model Features

1. International leading single die bonder and double swing arms, with programmable constant temperature double adhesive, and chip searching system.

2. Independently developed visual system & industrial computer control system, simplifying the operation of automatic equipment, easy to operate & maintain.

3. Automatic loading and unloading of materials/products, the loading of stacking material suction leadframe has the function of paper suction, and magazine unloading, effectively improving the production efficiency.

4. Screw servo drive is adopted to drive chip searching platform (X/Y) and linear motor is adopted to drive feeding platform (B/C).

5. Automatic frame-correcting wafer structure and automatic blue-expanding membrane structure, compatible with 8-inch and 6-inch wafers.

6. Single die bonder and double swing arms, bondforce parameter adjustment, flow-type chip vacuum leaking detection crystal measurement, stable and reliable.

7. Programmable constant temperature double adhesive module, greatly improving efficiency, glue point accuracy and consistency.

8. Precise location and good consistency of die bonding, guarantee of high quality.

9. Beat: 120 ms/point. Actual output depends on chip size and the density of products on the leadframe.

10. The material incoming and receiving adopt plug-in mode, and multiple equipments can be operated online.