HAD812

HAD812

Automatic Plane-type Die Bonder

Cycle: 250ms

It is compatible with IC frame

1.        Linear motor is applied to drive double dispensing system.

2.        High precision linear motor drive die bonder, voice coil torsion loop controls die bond pressure accurately.

3.        High-precision die platform searching, servo motor driving die angle correction system, equipped with 12-inch wafer automatic film expansion system.

4.        A separate dispensing control system is adopted to make a precise control of dispensing amount.

5.        Vacuum die missing testing technology is adopted.

6.        IPC control the operation of equipment, simplifying the operation of automation equipment;

7.        Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.